Application Note 1176
by clipping a test lead to the JP1 shunt, or if an external V CC
supply is used it should be connected to the center pin of
JP1 (shunt is removed). A ground connection is available at
J3.
BACKUP SUPPLY
There are two sources of backup supply available. A 0.22μF
supercapacitor (C10) is on the board. It will provide enough
backup power for the typical RTC chip to last many days at
room temperature when V CC is set to 5V. There is also a
CR2032 battery included in a socket to allow removal/
replacement without soldering. This battery will last up to ten
years in normal backup operation. The backup supply is
selectable via jumper JP2 as shown in Figure 3. One row of
JP2 is connected to the device V BACK , and the other row to
the power sources. There are three positions possible on
JP2, Supercap, Battery, and Ground. If no backup is used
the Ground position should be used. The jumper may be
removed altogether and an alternative source for V BACK can
be attached to the board via the exposed header.
MICROCONTROLLER
The microcontroller used is the PIC16C63A. It has a
dedicated serial interface which connects to the FDTI USB
device. There is a dedicated I 2 C serial interface connected
to the Intersil RTC device, EEPROM, and the temperature
sensor. The power for the microcontroller comes from the
USB 5V input, so the microcontroller will always be powered
from 5V. Note that the RB1 to RB4 I/O pins for the
microcontroller are available at the daughtercard connector,
J3. This is to enable identification of the RTC daughtercard
and thus enable functions for a particular device family. The
device is socketed to allow removal or replacement for
development activity and software upgrades with a newly-
programmed device.
DAUGHTERCARD CONNECTOR (J3)
This connector provides power and interface signals to the
daughtercard containing the Intersil RTC device as follows:
Pin 1: V CC
Pin 2: RB4
Pin 3: RB3
Pin 4: RB2
Pin 5: RB1
Pin 6: RB0 or Event Input
Pin 7: SDA
Pin 8: SCL
Pin 9: V BAT
Pin 10: GND
This configuration allows these signals to control the Intersil
device on an external board by connecting the serial
interface and ground, available at the connector. Also
available are the RB0 to RB4 I/O signals from the
microcontroller (see Microcontroller section).
SUPERCAP
V CC SELECT
DAUGHTERBOARD
CONNECTOR
SHUNT
BACKUP
BATTERY
SOCKET
4
FIGURE 3. RTC-USB MOTHERBOARD LAYOUT
FOR V BACK
SELECT
AN1176.0
June 20, 2005
相关PDF资料
ISL21007-EVALZ EVAL BOARD FOR ISL21007
ISL21032-EVALZ EVAL BOARD FOR ISL21032
ISL21060-EVALZ EVAL BOARD FOR ISL21060
ISL21080-EVALZ EVAL BOARD FOR ISL21080
ISL2109012EV1Z BOARD EVAL 1.25V VREF ISL21090
ISL21400USB-EVALZ EVAL BOARD FOR ISL21400
ISL28210SOICEVAL1Z EVAL BOARD FOR ISL28210 8SOIC
ISL28217SOICEVAL2Z EVAL BAORD FOR ISL28217 8SOIC
相关代理商/技术参数
ISL1208IB8 功能描述:IC RTC/CALENDAR I2C 8-SOIC RoHS:否 类别:集成电路 (IC) >> 时钟/计时 - 实时时钟 系列:- 产品培训模块:Obsolescence Mitigation Program 标准包装:1 系列:- 类型:时钟/日历 特点:警报器,闰年,SRAM 存储容量:- 时间格式:HH:MM:SS(12/24 小时) 数据格式:YY-MM-DD-dd 接口:SPI 电源电压:2 V ~ 5.5 V 电压 - 电源,电池:- 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:8-WDFN 裸露焊盘 供应商设备封装:8-TDFN EP 包装:管件
ISL1208IB8-TK 功能描述:IC RTC/CALENDAR I2C 8-SOIC RoHS:否 类别:集成电路 (IC) >> 时钟/计时 - 实时时钟 系列:- 产品培训模块:Obsolescence Mitigation Program 标准包装:1 系列:- 类型:时钟/日历 特点:警报器,闰年,SRAM 存储容量:- 时间格式:HH:MM:SS(12/24 小时) 数据格式:YY-MM-DD-dd 接口:SPI 电源电压:2 V ~ 5.5 V 电压 - 电源,电池:- 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:8-WDFN 裸露焊盘 供应商设备封装:8-TDFN EP 包装:管件
ISL1208IB8Z 功能描述:实时时钟 I2C REAL TIME CLOCK/ CALENDAR 8LD RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 总线接口:I2C 日期格式:DW:DM:M:Y 时间格式:HH:MM:SS RTC 存储容量:64 B 电源电压-最大:5.5 V 电源电压-最小:1.8 V 最大工作温度:+ 85 C 最小工作温度: 安装风格:Through Hole 封装 / 箱体:PDIP-8 封装:Tube
ISL1208IB8ZR5291 功能描述:实时时钟 I2CAL TIME CLK/CLNDR ALL BATRY MODE TESTS RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 总线接口:I2C 日期格式:DW:DM:M:Y 时间格式:HH:MM:SS RTC 存储容量:64 B 电源电压-最大:5.5 V 电源电压-最小:1.8 V 最大工作温度:+ 85 C 最小工作温度: 安装风格:Through Hole 封装 / 箱体:PDIP-8 封装:Tube
ISL1208IB8Z-T7A 功能描述:实时时钟 I2CAL TIME CLK/CLNDR 8LD RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 总线接口:I2C 日期格式:DW:DM:M:Y 时间格式:HH:MM:SS RTC 存储容量:64 B 电源电压-最大:5.5 V 电源电压-最小:1.8 V 最大工作温度:+ 85 C 最小工作温度: 安装风格:Through Hole 封装 / 箱体:PDIP-8 封装:Tube
ISL1208IB8Z-TK 功能描述:实时时钟 I2C REAL TIME CLOCK/ CALENDAR 8LD RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 总线接口:I2C 日期格式:DW:DM:M:Y 时间格式:HH:MM:SS RTC 存储容量:64 B 电源电压-最大:5.5 V 电源电压-最小:1.8 V 最大工作温度:+ 85 C 最小工作温度: 安装风格:Through Hole 封装 / 箱体:PDIP-8 封装:Tube
ISL1208IB8Z-TKR5291 功能描述:实时时钟 I2CAL TIME CLK/CLNDR BATRY MODE TESTS RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 总线接口:I2C 日期格式:DW:DM:M:Y 时间格式:HH:MM:SS RTC 存储容量:64 B 电源电压-最大:5.5 V 电源电压-最小:1.8 V 最大工作温度:+ 85 C 最小工作温度: 安装风格:Through Hole 封装 / 箱体:PDIP-8 封装:Tube
ISL1208IRT8Z 功能描述:实时时钟 I2CAL TIME CLK/CLNDR 8LD 3X3 RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 总线接口:I2C 日期格式:DW:DM:M:Y 时间格式:HH:MM:SS RTC 存储容量:64 B 电源电压-最大:5.5 V 电源电压-最小:1.8 V 最大工作温度:+ 85 C 最小工作温度: 安装风格:Through Hole 封装 / 箱体:PDIP-8 封装:Tube